XCVM1502-1MLIVFVC1760
XCVM1502-1MLIVFVC1760
Part number
XCVM1502-1MLIVFVC1760
Product Categories
System On Chip (SoC)
Manufacturer
Xilinx (AMD)
Describe
IC VERSALPRIME ACAP FPGA 1760BGA
Encapsulation
-
Package
Tray
ROHS status
Yes
Price
USD $2,985.3750
Data sheet
Quantity
RFQ
In stock: 0
Smallest : 1
Multiple : 1
Quantity
Unit price
Price
1
$2,985.3750
$2,985.3750
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Purchase and inquiry
Specification
Transport
Data sheet
ABLIC U.S.A. Inc. S-1132B33-I6T2U has similar specifications, properties, parameters and parts as ABLIC U.S.A. Inc. S-1132B33-I6T2U.
TYPEDESCRIPTION
MfrXilinx (AMD)
SeriesVersal™ Prime
PackageTray
Product StatusACTIVE
Package / Case1760-BFBGA, FCBGA
Speed600MHz, 1.3GHz
RAM Size256KB
Number of I/O500
Operating Temperature-40°C ~ 110°C (TJ)
Core ProcessorDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary AttributesVersal™ Prime FPGA, 1M Logic Cells
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDDR, DMA, PCIe
Supplier Device Package1760-FCBGA (40x40)
ArchitectureMPU, FPGA

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Delivery time


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FedEx International, 5-7 business days.

The following are logistics times for some common countries.

transport

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