[API] response: [200 OK] "{\"code\":200,\"msg\":\"请求成功\",\"data\":[{\"id\":122,\"platform\":\"DK\",\"name\":\"Xilinx (AMD)\",\"slug_name\":\"XILINX-AMD\",\"sort\":9997,\"description\":\"AMD is a leading provider of All Programmable FPGAs, SoCs, MPSoCs, and 3D ICs. AMD uniquely enables applications that are both software defined and hardware optimized – powering industry advancements in Cloud Computing, 5G Wireless, Embedded Vision, and Industrial IoT.\",\"logo\":\"http://oss.icku.net/icku/brand/1724653126.png\",\"catego (truncated) ... [elapsed: 0.022771 secs]
[API] response: [200 OK] "{\"code\":200,\"msg\":\"success\",\"data\":{\"id\":219,\"parent_id\":2047,\"name\":\"Heat Sinks\",\"path\":\"0;16;2047;219;\",\"product_count\":113883,\"slug_name\":\"heat-sinks\",\"description\":\"Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding (truncated) ... [elapsed: 0.036491 secs]
[API] response: [200 OK] "{\"code\":200,\"msg\":\"success\",\"data\":{\"id\":16,\"parent_id\":0,\"name\":\"Fans, Blowers, Thermal Management\",\"path\":\"0;16;\",\"product_count\":156823,\"slug_name\":\"fans-thermal-management\",\"description\":\"The fan and thermal management category includes products and materials used to facilitate heat transfer and/or air movement, and accessories related to such products. Along with AC and DC fans and heat sinks, thermally-conductive adhesives, thermal interface products, heat pip (truncated) ... [elapsed: 0.034449 secs]
[API] response: [200 OK] "{\"code\":200,\"msg\":\"success\",\"data\":{\"id\":219,\"parent_id\":2047,\"name\":\"Heat Sinks\",\"path\":\"0;16;2047;219;\",\"product_count\":113883,\"slug_name\":\"heat-sinks\",\"description\":\"Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding (truncated) ... [elapsed: 0.036342 secs]